MID4automative: Mechatronic Integrated Devices for Automotive Radar Systems

Overview

Novel and innovative technologies like automated and autonomous driving will provide solutions to pressing global issues related to traffic. Autonomous cars will contribute by optimizing traffic flows, resulting in a more efficient use of energy resources and infrastructure. In addition, they ensure better traffic regulation, which results in fewer casualties and more safety. To maintain a leading position in this sector, European car manufacturers must adapt to the needs of the changing market by addressing key technical challenges around autonomous driving.

Radar systems are a basic prerequisite for automated and autonomous driving. However, the amount of radar sensors per car must increase from one to about ten in the future to allow for full autonomy. This, in turn, demands very cost-effective solutions without compromising on their performance. Moreover, these sensors must be easily integrable in the car exterior, yet invisible to the eye of the customer. The alignment within the vehicle must be precise while the replacement shall be possible without significant effort. Moreover, future onboard wireless communication systems are required to enable higher data rates, lower latency and much higher reliability. To address this need, new antenna types and distributed antenna systems with antenna elements that are spread across the entire car are needed, also calling for different integration strategies in the interior and exterior of the car.

This project will address the integration challenges of both application domains, i.e., automotive radar and connectivity, by the use of 3D-MID technology. 3D-MID is a packaging and integration technology that allows for three-dimensional arrangements of components and great flexibility in the shape of the final module. In the past years it has matured from a pure research topic towards high technology readiness levels (TRLs) and is already explored and adopted in many domains. Also, for the automotive sector 3D-MID is a promising solution. However, the usually rather conservative European car industry has not yet started to explore its possibilities, even though Europe is home to some of the word-leading companies and research organisations in this area. Therefore, this project is aiming to bridge the gap between the car manufacturers on one hand and the 3D-MID companies and experts on the other hand to help both industries to maintain and expand their leadership in their areas.

The targeted innovations in this project is the adaptation of the technology towards its use in wireless automotive modules through the development of a radar sensor in 3D-MID technology that is directly integrated into the bumper of a car. This module aims to surpass the angular resolution of state-of-the-art radar modules by a factor six. Moreover, the integration of bare-dies into 3D-MID technology as well the integration of fibre-optic components to allow for low-loss interconnections of multiple radar sensors are targeted innovations in this project.

To achieve this, the consortium includes world-leading European companies, research institutes and universities that the end user, technology providers, component and (sub-)system manufacturers as well as system test specialists. Together, they are targeting international markets worth billions of euros.

Key Facts

Project duration:
03/2023 - 02/2026
Funded by:
BMBF

More Information

Principal Investigators

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Prof. Dr.-Ing. J. Christoph Scheytt

System and Circuit Technology / Heinz Nixdorf Institut

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Cooperating Institutions

Fraunhofer Institut für Entwurfstechnik Mechatronik IEM

Cooperating Institution

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Fujikura Technology Europe

Cooperating Institution

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Konrad GmbH

Cooperating Institution

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MID Solutions GmbH

Cooperating Institution

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NXP Semiconductors Germany GmbH

Cooperating Institution

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Volkswagen Group

Cooperating Institution

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perisens GmbH

Cooperating Institution

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Contact

If you have any questions about this project, contact us!

Stephan Kruse

System and Circuit Technology / Heinz Nixdorf Institut

Wissenschaftlicher Mitarbeiter

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+49 5251 60-6338 F0.411